Invention Grant
- Patent Title: Laminated ceramic electronic component
- Patent Title (中): 层压陶瓷电子元件
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Application No.: US12616844Application Date: 2009-11-12
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Publication No.: US08228663B2Publication Date: 2012-07-24
- Inventor: Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
- Applicant: Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-290702 20081113
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/06

Abstract:
In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
Public/Granted literature
- US20100118467A1 LAMINATED CERAMIC ELECTRONIC COMPONENT Public/Granted day:2010-05-13
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