Invention Grant
- Patent Title: Connections for electronic devices on double-sided circuit board
- Patent Title (中): 双面电路板上电子设备的连接
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Application No.: US12080311Application Date: 2008-04-02
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Publication No.: US08228679B2Publication Date: 2012-07-24
- Inventor: Thomas H. Shilling , Todd Snider , Melissa Grupen-Shemansky
- Applicant: Thomas H. Shilling , Todd Snider , Melissa Grupen-Shemansky
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is connected to a contact of the second device by a connector though the circuit board. At least one of the contacts of the first device is connected to the contact of the second device which is most adjacent to that contact of the first device across the circuit board.
Public/Granted literature
- US20090250255A1 Connections for electronic devices on double-sided circuit board Public/Granted day:2009-10-08
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