Invention Grant
- Patent Title: Time stamp offset in data packet bundling
- Patent Title (中): 数据包捆绑中的时间戳偏移
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Application No.: US11315544Application Date: 2005-12-22
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Publication No.: US08228956B2Publication Date: 2012-07-24
- Inventor: Robert S. Gammenthaler, Jr. , Brian Tatum
- Applicant: Robert S. Gammenthaler, Jr. , Brian Tatum
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: RG & Associates
- Main IPC: H04J3/06
- IPC: H04J3/06
Abstract:
A system, method, and computer readable medium for time stamp offset in data packet bundling including filling a globally distributed time stamp based upon a globally distributed time, receiving a signal unit, resolving a difference in time between the globally distributed time stamp and the reception of the signal unit and assigning a time offset based upon the resolved time difference.
Public/Granted literature
- US20060233202A1 Time stamp offset in data packet bundling Public/Granted day:2006-10-19
Information query
