Invention Grant
- Patent Title: Headphone device
- Patent Title (中): 耳机设备
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Application No.: US11973508Application Date: 2007-10-09
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Publication No.: US08229154B2Publication Date: 2012-07-24
- Inventor: Tomohiro Ito
- Applicant: Tomohiro Ito
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Frommer Lawrence & Haug LLP
- Agent William S. Frommer; Paul A. Levy
- Priority: JP2006-277872 20061011
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
The present invention provides a more excellent headphone device that is provided with the portability and operability as compared with that in the past. The present invention provides a device that is connected to an electronic device through a connecting cord which includes a housing, a reeling section that reels up a headphone cord of a headphone to the inside of the housing, an attachment section that is arranged on the housing, and is to be attached to the user, and a link section that physically links any one of the housing and the attachment section to the electronic device.
Public/Granted literature
- US20080089544A1 Headphone device Public/Granted day:2008-04-17
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