Invention Grant
- Patent Title: Method for simulating the behavior of a bonded joint of two parts
- Patent Title (中): 模拟两部分接合接头行为的方法
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Application No.: US12080087Application Date: 2008-03-31
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Publication No.: US08229717B2Publication Date: 2012-07-24
- Inventor: Ignacio Riveira Rodriguez , Juan Luis de La Gándara Verano
- Applicant: Ignacio Riveira Rodriguez , Juan Luis de La Gándara Verano
- Applicant Address: ES Madrid
- Assignee: Airbus Espana, S.L.
- Current Assignee: Airbus Espana, S.L.
- Current Assignee Address: ES Madrid
- Agency: Ladas & Parry LLP
- Priority: ES200800236 20080130
- Main IPC: G06G7/48
- IPC: G06G7/48

Abstract:
A method for simulating the behavior of a bonded joint of two composite material parts with an adhesive material layer. The method includes the steps of a) providing a Finite Element Model with all the relevant information for analyzing the structural joint; b) providing a calculation model for calculating the deformations of the adhesive material layer when it is subjected to tensile/peel and shear stresses, including a plastic behavior of the adhesive of a linear type under tension/peeling and of a non-linear type under shearing; and c) simulating the behavior of the bonded joint by applying the calculation model to obtain the failure indices of each failure mode. A system which is useful as an aid in the design of the structural joint using a computer-implemented Finite Element Model of the structural joint.
Public/Granted literature
- US20090192766A1 Method for simulating the behavior of a bonded joint of two parts Public/Granted day:2009-07-30
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