Invention Grant
- Patent Title: Package systems having a conductive element through a substrate thereof and manufacturing methods of the same
- Patent Title (中): 具有通过其基材的导电元件的封装体系及其制造方法
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Application No.: US13042733Application Date: 2011-03-08
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Publication No.: US08232614B1Publication Date: 2012-07-31
- Inventor: Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin , Chia-Ming Hung , Jung-Huei Peng , Yi Heng Tsai , Jiou-Kang Lee
- Applicant: Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin , Chia-Ming Hung , Jung-Huei Peng , Yi Heng Tsai , Jiou-Kang Lee
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: H01L21/52
- IPC: H01L21/52
Abstract:
A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one first conductive structure is electrically coupled with the second substrate through at least one germanium-containing layer.
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