Invention Grant
- Patent Title: Electronic fuses in semiconductor integrated circuits
- Patent Title (中): 半导体集成电路中的电子保险丝
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Application No.: US12870921Application Date: 2010-08-30
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Publication No.: US08232620B2Publication Date: 2012-07-31
- Inventor: Louis Lu-Chen Hsu , Jack Allan Mandelman , William Robert Tonti , Chih-Chao Yang
- Applicant: Louis Lu-Chen Hsu , Jack Allan Mandelman , William Robert Tonti , Chih-Chao Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Richard M. Kotulak
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
A structure. The structure includes: a substrate; a first electrode in the substrate; a dielectric layer on top of the substrate and the electrode; a second dielectric layer on the first dielectric layer, said second dielectric layer comprising a second dielectric material; a fuse element buried in the first dielectric layer, wherein the fuse element (i) physically separates, (ii) is in direct physical contact with both, and (iii) is sandwiched between a first region and a second region of the dielectric layer; and a second electrode on top of the fuse element, wherein the first electrode and the second electrode are electrically coupled to each other through the fuse element.
Public/Granted literature
- US20100320563A1 ELECTRONIC FUSES IN SEMICONDUCTOR INTEGRATED CIRCUITS Public/Granted day:2010-12-23
Information query
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