Invention Grant
- Patent Title: Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
- Patent Title (中): 包含用于电熔丝和其他相关应用的各种封盖材料的互连结构的结构
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Application No.: US13052662Application Date: 2011-03-21
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Publication No.: US08232649B2Publication Date: 2012-07-31
- Inventor: Louis L. Hsu , William R. Tonti , Chih-Chao Yang
- Applicant: Louis L. Hsu , William R. Tonti , Chih-Chao Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/58 ; H01L23/62 ; H01L29/00 ; H01L27/10 ; H01L29/73 ; H01L29/74
Abstract:
A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.
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