Invention Grant
US08233064B2 Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same
失效
固体摄像装置及其制造方法以及包括该固体摄像装置的电子装置
- Patent Title: Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same
- Patent Title (中): 固体摄像装置及其制造方法以及包括该固体摄像装置的电子装置
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Application No.: US12315327Application Date: 2008-12-02
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Publication No.: US08233064B2Publication Date: 2012-07-31
- Inventor: Masao Nakamura
- Applicant: Masao Nakamura
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Edwards Wildman Palmer LLP
- Agent David G. Conlin; David A. Tucker
- Priority: JP2007-312764 20071203
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/235 ; H04N5/225

Abstract:
In a solid-state image pickup apparatus 100 of the invention, a transparent member 4 that covers a light receiving section of a solid-state image sensing device 2 is located within an opening 10 of a wiring board 1. The solid-state image sensing device 2 is adhered to the backside of the wiring board 1 via a conductive member 5 and also sealed to the backside of the wiring board 1 with an encapsulation resin 6 formed around the solid-state image sensing device 2. Furthermore, a through-hole 11 passing through the wiring board 1 in a thickness direction is formed on outside of the opening 10 of the wiring board 1, and the through-hole 11 is filled with the encapsulation resin 6. This configuration provides the solid-state image pickup apparatus 100 in which the encapsulation resin 6 can be easily injected to the surrounding area of the solid-state image sensing device 2.
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