Invention Grant
US08233064B2 Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same 失效
固体摄像装置及其制造方法以及包括该固体摄像装置的电子装置

Solid-state image pickup apparatus, method of manufacturing the same, and electronic device including the same
Abstract:
In a solid-state image pickup apparatus 100 of the invention, a transparent member 4 that covers a light receiving section of a solid-state image sensing device 2 is located within an opening 10 of a wiring board 1. The solid-state image sensing device 2 is adhered to the backside of the wiring board 1 via a conductive member 5 and also sealed to the backside of the wiring board 1 with an encapsulation resin 6 formed around the solid-state image sensing device 2. Furthermore, a through-hole 11 passing through the wiring board 1 in a thickness direction is formed on outside of the opening 10 of the wiring board 1, and the through-hole 11 is filled with the encapsulation resin 6. This configuration provides the solid-state image pickup apparatus 100 in which the encapsulation resin 6 can be easily injected to the surrounding area of the solid-state image sensing device 2.
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