Invention Grant
US08233235B2 PMR writer having a tapered write pole and bump layer and method of fabrication
有权
PMR写入器具有锥形写极点和凸起层及其制造方法
- Patent Title: PMR writer having a tapered write pole and bump layer and method of fabrication
- Patent Title (中): PMR写入器具有锥形写极点和凸起层及其制造方法
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Application No.: US12634514Application Date: 2009-12-09
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Publication No.: US08233235B2Publication Date: 2012-07-31
- Inventor: Yingjian Chen , Liubo Hong , Yimin Hsu
- Applicant: Yingjian Chen , Liubo Hong , Yimin Hsu
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Patterson & Sheridan, LLP
- Main IPC: G11B5/147
- IPC: G11B5/147 ; G11B5/23

Abstract:
Methods for fabrication of tapered magnetic poles with a non-magnetic front bump layer. A magnetic pole may have a tapered surface at or near an air bearing surface (ABS), wherein a thickness of the write pole increases in a direction away from the ABS. A non-magnetic front bump layer may be formed on the tapered surface of the magnetic pole and away from the ABS. The front bump layer may increase the separation distance between a shield layer and the magnetic pole near the tapered surface, thereby improving the performance of the write head.
Public/Granted literature
- US20110134568A1 PMR WRITER AND METHOD OF FABRICATION Public/Granted day:2011-06-09
Information query
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