Invention Grant
US08233287B2 Ground vias for enhanced preamp heat release in hard disk drives
有权
用于硬盘驱动器中增强前置放热释放的通孔
- Patent Title: Ground vias for enhanced preamp heat release in hard disk drives
- Patent Title (中): 用于硬盘驱动器中增强前置放热释放的通孔
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Application No.: US12024857Application Date: 2008-02-01
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Publication No.: US08233287B2Publication Date: 2012-07-31
- Inventor: Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
- Applicant: Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Main IPC: H05K7/10
- IPC: H05K7/10

Abstract:
Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.
Public/Granted literature
- US20080186623A1 GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES Public/Granted day:2008-08-07
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