Invention Grant
- Patent Title: Power amplification apparatus for envelope modulation of high frequency signal and method for controlling the same
- Patent Title (中): 用于高频信号包络调制的功率放大装置及其控制方法
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Application No.: US12927258Application Date: 2010-11-10
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Publication No.: US08233860B2Publication Date: 2012-07-31
- Inventor: Jae-Sub Lee
- Applicant: Jae-Sub Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2009-0108150 20091110
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04K3/00

Abstract:
A power amplification apparatus and method provide for controlling envelope modulation of a Radio Frequency (RF) signal. The power amplification apparatus includes a linear amplifier configured to receive an input signal to be amplified, and generate a linear output signal for compensating for a current ripple of an amplified signal and a switch control signal having a current obtained by dividing the linear output signal by a predetermined ratio. The power amplification apparatus also includes a switching amplifier configured to receive the switch control signal through a multi-mode resistor having a variable resistance, and generate the amplified signal. The variable resistance of the multi-mode resistor determines a switching frequency representing an operating speed of the switching amplifier, and is adjusted according to a communication mode of the input signal.
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