Invention Grant
- Patent Title: Cook hinge
- Patent Title (中): 厨师铰链
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Application No.: US12290025Application Date: 2008-10-24
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Publication No.: US08234753B2Publication Date: 2012-08-07
- Inventor: Jay W. Cook
- Applicant: Jay W. Cook
- Applicant Address: US TX Greenville
- Assignee: L-3 Communications Integrated Systems L.P.
- Current Assignee: L-3 Communications Integrated Systems L.P.
- Current Assignee Address: US TX Greenville
- Agency: O'Keefe, Egan, Peterman & Enders LLP
- Main IPC: E05D7/10
- IPC: E05D7/10

Abstract:
A hinge assembly may be provided to hingeably couple two substrates together to allow one of the substrates to pivot about the center plane of the other substrate. The hinge assembly may include two separable hinge components that are manufactured from lightweight materials and that are configured to provide up to about 180 degrees of swing for a door or other hingeably-coupled substrate. Polymer bushings may be employed to preclude the need for lubrication of the hinge assembly, and a spring loaded tab may be provided on a hinge pin of the hinge assembly to provide for ease of installation, removal or replacement of a hingeably coupled substrate. Flow channels with injection ports may be defined within each of the separable hinge components of the hinge assembly, and configured to evenly distribute injected bonding material around the components of the hinge assembly while they are positioned within respective substrate cavities.
Public/Granted literature
- US20100101054A1 Cook hinge Public/Granted day:2010-04-29
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