Invention Grant
- Patent Title: Apparatus and method for forming electronic devices
- Patent Title (中): 用于形成电子装置的装置和方法
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Application No.: US12751308Application Date: 2010-03-31
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Publication No.: US08234773B2Publication Date: 2012-08-07
- Inventor: Sarah S. Bedair , Brian Morgan , Christopher D. Meyer
- Applicant: Sarah S. Bedair , Brian Morgan , Christopher D. Meyer
- Applicant Address: US DC Washington
- Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee Address: US DC Washington
- Agent Lawrence E. Anderson
- Main IPC: G01N15/06
- IPC: G01N15/06 ; G01N33/00 ; G01N33/48

Abstract:
A method of forming at least one electronic device on a substrate comprising creating a depository and an attached capillary; providing a liquid containing particles in the range 1 nanometer to 1 millimeter for deposit into the depository; the liquid flowing into the at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; whereby the agglomerate is used to form a part of the at least one electronic device. An microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate formed by at least one wall, a capillary channel coupled to said depository adapted to be filled with liquid comprising nanoparticles by capillary action, whereby as the liquid evaporates, an agglomerate forms in the capillary channel having a substantially uniform distribution of the particles.
Public/Granted literature
- US20110018136A1 APPARATUS AND METHOD FOR FORMING ELECTONIC DEVICES Public/Granted day:2011-01-27
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