Invention Grant
- Patent Title: Apparatus and method for damage location and identification in structures
- Patent Title (中): 损坏位置和结构识别的装置和方法
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Application No.: US12504595Application Date: 2009-07-16
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Publication No.: US08234924B2Publication Date: 2012-08-07
- Inventor: Indu Saxena , Lothar Kempen , Chai Tea
- Applicant: Indu Saxena , Lothar Kempen , Chai Tea
- Applicant Address: US CA Torrance
- Assignee: Optech Ventures, LLC
- Current Assignee: Optech Ventures, LLC
- Current Assignee Address: US CA Torrance
- Agent Lawrence S. Cohen
- Main IPC: G01N29/00
- IPC: G01N29/00 ; G02B6/00
Abstract:
An apparatus and method for testing composite structures in which ultrasonic waves are used to detect disbonds in the structures are described. The apparatus comprises a flexible structure carrying acousto-optical transducers such as fiber Bragg gratings. During use, the apparatus is mechanically and conformally coupled to the structure under test.
Public/Granted literature
- US20100011865A1 APPARATUS AND METHOD FOR DAMAGE LOCATION AND IDENTIFICATION IN STRUCTURES Public/Granted day:2010-01-21
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