An apparatus for shock isolating an electronics package includes an outer member including an internal threaded portion and a transition member including an external threaded portion and a hollow inner portion that defines a cavity configured for receiving the electronics package. A layer of mechanically compliant shock isolation material is positioned between the inner thread portion of the outer member and the external thread portion of the transition member. The compliant shock isolation material encloses a front end and sidewalls of the transition member and is absent from its aft end to allow access to one end of the electronics package (e.g. to a connector). The internal threaded portion of the outer member and the external threaded portion of the transition member are compliantly engaged via a gap provided by the layer of compliant shock isolation material. In one embodiment the electronics package is a fuze assembly.