Invention Grant
- Patent Title: Substrate processing systems and related methods
- Patent Title (中): 基板加工系统及相关方法
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Application No.: US12387314Application Date: 2009-04-30
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Publication No.: US08235068B2Publication Date: 2012-08-07
- Inventor: Kurt K. Christenson
- Applicant: Kurt K. Christenson
- Applicant Address: US MN Chaska
- Assignee: FSI International, Inc.
- Current Assignee: FSI International, Inc.
- Current Assignee Address: US MN Chaska
- Agency: Kagan Binder, PLLC
- Main IPC: G05D7/06
- IPC: G05D7/06

Abstract:
A system for processing one or more substrates according to the present invention includes a diversion valve that can deliver two or more process fluids to a dispensing device through a common line/pipe. The present invention also includes related methods.
Public/Granted literature
- US20090277507A1 Substrate processing systems and related methods Public/Granted day:2009-11-12
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