Invention Grant
US08235075B2 Method and apparatus for patching a well by hydroforming a tubular metal patch, and a patch for this purpose
有权
用于通过液压成形管状金属贴片来修补井的方法和装置,以及用于该目的的贴片
- Patent Title: Method and apparatus for patching a well by hydroforming a tubular metal patch, and a patch for this purpose
- Patent Title (中): 用于通过液压成形管状金属贴片来修补井的方法和装置,以及用于该目的的贴片
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Application No.: US12303474Application Date: 2006-11-10
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Publication No.: US08235075B2Publication Date: 2012-08-07
- Inventor: Jean-Louis Saltel
- Applicant: Jean-Louis Saltel
- Applicant Address: FR Le Rheu
- Assignee: Saltel Industries
- Current Assignee: Saltel Industries
- Current Assignee Address: FR Le Rheu
- Agency: Pauley Petersen & Erickson
- Priority: FR0604987 20060606
- International Application: PCT/EP2006/068361 WO 20061110
- International Announcement: WO2007/140820 WO 20071213
- Main IPC: F16L55/16
- IPC: F16L55/16

Abstract:
A method of patching a well or a pipe by hydroforming a tubular metal patch. A tool provided with a pair of inflatable packers is inserted inside the patch. The pair of inflatable packers are axially spaced apart from each other by a distance that is substantially equal to the length of the patch. The tool is positioned inside the patch so that the packers are in register with the end portions of the patch. The assembly of the tool and the patch is axially inserted inside the well or the pipe, and positioned in register with the zone for patching. The packers are inflated to a high pressure, sufficient for radially expanding the end portions of the patch and pressing them in a leak-tight manner against the wall of the well or the pipe. The packers are subsequently deflated and the tool is withdrawn. The method is applicable to the oil industry.
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