Invention Grant
US08235768B2 Cooler with ground heated plane and grinding method and apparatus thereof
有权
具有地面加热平面的冷却器及其研磨方法和装置
- Patent Title: Cooler with ground heated plane and grinding method and apparatus thereof
- Patent Title (中): 具有地面加热平面的冷却器及其研磨方法和装置
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Application No.: US12482000Application Date: 2009-06-10
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Publication No.: US08235768B2Publication Date: 2012-08-07
- Inventor: Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
- Applicant: Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
- Applicant Address: TW Taipei County TW Taipei County
- Assignee: Golden Sun News Techniques Co., Ltd.,Cpumate Inc
- Current Assignee: Golden Sun News Techniques Co., Ltd.,Cpumate Inc
- Current Assignee Address: TW Taipei County TW Taipei County
- Agency: HDLS IPR Services
- Agent Chun Ming Shih
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
Public/Granted literature
- US20100314078A1 COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF Public/Granted day:2010-12-16
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