Invention Grant
- Patent Title: Apparatus for placing medical implants
- Patent Title (中): 放置医疗植入物的装置
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Application No.: US12143408Application Date: 2008-06-20
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Publication No.: US08236013B2Publication Date: 2012-08-07
- Inventor: Michael S. H. Chu
- Applicant: Michael S. H. Chu
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Main IPC: A61B17/04
- IPC: A61B17/04

Abstract:
An apparatus includes a carrier configured to be movably disposed within a channel defined by an elongate member. The carrier includes a proximal end portion and a distal end portion. The proximal end portion is configured to be coupled to an actuator. The distal end portion includes a protrusion and an engagement surface. The protrusion has a tip configured to bodily pierce tissue. The protrusion is configured to be received within a lumen defined by a connecting portion of an implant, such as, for example, a pelvic floor implant, such that the tip extends through the lumen defined by the connecting portion of the implant. The engagement surface is configured to engage a portion of the connecting portion of the implant to limit movement of the connecting portion of the implant relative to the protrusion.
Public/Granted literature
- US20090105743A1 APPARATUS FOR PLACING MEDICAL IMPLANTS Public/Granted day:2009-04-23
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