Invention Grant
- Patent Title: Substrate processing system and substrate transfer method
- Patent Title (中): 基板处理系统和基板转印方法
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Application No.: US12302853Application Date: 2007-06-15
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Publication No.: US08236132B2Publication Date: 2012-08-07
- Inventor: Yuichi Yamamoto , Tadayuki Yamaguchi , Yasuhito Saiga , Yoshiaki Yamada
- Applicant: Yuichi Yamamoto , Tadayuki Yamaguchi , Yasuhito Saiga , Yoshiaki Yamada
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-165620 20060615
- International Application: PCT/JP2007/062100 WO 20070615
- International Announcement: WO2007/145314 WO 20071221
- Main IPC: B65G49/07
- IPC: B65G49/07

Abstract:
A substrate processing system (100) includes a first automated substrate transfer line or main transfer line (20) configured to transfer wafers (W) over the entire system and to transfer wafers to and from respective process sections, and a second automated substrate transfer line or auxiliary transfer line (30) configured to transfer wafers (W) inside a photolithography process section (1a). The auxiliary transfer line (30) is disposed as a transfer mechanism independent of the main transfer line (20). An OHT (31) is configured to travel around on the auxiliary transfer line (30) having a loop shape, so as to transfer wafers (W) to and from and among the respective process apparatuses in the photolithography process section (1a).
Public/Granted literature
- US20090185151A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE TRANSFER METHOD Public/Granted day:2009-07-23
Information query
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