Invention Grant
- Patent Title: Electrolytic process using cation permeable barrier
- Patent Title (中): 使用阳离子渗透屏障的电解过程
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Application No.: US11414145Application Date: 2006-04-28
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Publication No.: US08236159B2Publication Date: 2012-08-07
- Inventor: Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
- Applicant: Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials Inc.
- Current Assignee: Applied Materials Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: C25D7/12
- IPC: C25D7/12 ; C25D3/38 ; C25F3/04 ; C25F3/18

Abstract:
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
Public/Granted literature
- US20060237323A1 Electrolytic process using cation permeable barrier Public/Granted day:2006-10-26
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