A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.