Invention Grant
- Patent Title: Adhesive sheet and process for producing electric components using the sheet
- Patent Title (中): 粘合片和使用该片生产电组件的方法
-
Application No.: US12095019Application Date: 2006-11-29
-
Publication No.: US08236416B2Publication Date: 2012-08-07
- Inventor: Satoru Kawata , Tomomichi Takatsu
- Applicant: Satoru Kawata , Tomomichi Takatsu
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Stein McEwen, LLP
- Priority: JP2005-353225 20051207
- International Application: PCT/JP2006/323832 WO 20061129
- International Announcement: WO2007/066553 WO 20070614
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/34 ; B32B27/38
Abstract:
An adhesive sheet and a method for producing electronic components using the sheet are provided.An adhesive sheet comprising a substrate layer; an antistatic layer formed on one surface of the substrate layer and containing an organic binder, an antistatic agent, an antifriction agent and a curing agent; and an adhesive layer formed on the other surface of the substrate layer; and a method for producing electronic components using the adhesive sheet.
Public/Granted literature
- US20090042035A1 ADHESIVE SHEET AND PROCESS FOR PRODUCING ELECTRIC COMPONENTS USING THE SHEET Public/Granted day:2009-02-12
Information query
