Invention Grant
- Patent Title: Metal film encapsulation
- Patent Title (中): 金属膜封装
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Application No.: US11687032Application Date: 2007-03-16
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Publication No.: US08236443B2Publication Date: 2012-08-07
- Inventor: Shawn W. Snyder , Bernd J. Neudecker , Paul C. Brantner
- Applicant: Shawn W. Snyder , Bernd J. Neudecker , Paul C. Brantner
- Applicant Address: US CO Littleton
- Assignee: Infinite Power Solutions, Inc.
- Current Assignee: Infinite Power Solutions, Inc.
- Current Assignee Address: US CO Littleton
- Agency: Fox Rothschild LLP
- Agent Jeff E. Schwartz
- Main IPC: H01M2/18
- IPC: H01M2/18
Abstract:
The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
Public/Granted literature
- US20070202395A1 METAL FILM ENCAPSULATION Public/Granted day:2007-08-30
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