Invention Grant
- Patent Title: Controlling edge emission in package-free LED die
- Patent Title (中): 无封装LED芯片中的控制边缘发射
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Application No.: US12577623Application Date: 2009-10-12
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Publication No.: US08236582B2Publication Date: 2012-08-07
- Inventor: James G. Neff , Serge J. Bierhuizen , John E. Epler
- Applicant: James G. Neff , Serge J. Bierhuizen , John E. Epler
- Applicant Address: US CA San Jose NL Eindhoven
- Assignee: Philips Lumileds Lighting Company, LLC,Koninklijke Philips Electronics N.V.
- Current Assignee: Philips Lumileds Lighting Company, LLC,Koninklijke Philips Electronics N.V.
- Current Assignee Address: US CA San Jose NL Eindhoven
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Light emitting diode (LED) structures are fabricated in wafer scale by mounting singulated LED dies on a carrier wafer or a stretch film, separating the LED dies to create spaces between the LED dies, applying a reflective coating over the LED dies and in the spaces between the LED dies, and separating or breaking the reflective coating in the spaces between the LED dies such that some reflective coating remains on the lateral sides of the LED die. Portions of the reflective coating on the lateral sides of the LED dies may help to control edge emission.
Public/Granted literature
- US20100029023A1 CONTROLLING EDGE EMISSION IN PACKAGE-FREE LED DIE Public/Granted day:2010-02-04
Information query
IPC分类:
