Invention Grant
- Patent Title: Forming semiconductor chip connections
- Patent Title (中): 形成半导体芯片连接
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Application No.: US12471656Application Date: 2009-05-26
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Publication No.: US08236610B2Publication Date: 2012-08-07
- Inventor: Louis Lu-Chen Hsu , Kangguo Cheng , Timothy J. Dalton , Mukta G. Farooq , John A. Fitzsimmons
- Applicant: Louis Lu-Chen Hsu , Kangguo Cheng , Timothy J. Dalton , Mukta G. Farooq , John A. Fitzsimmons
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Dan Schurmann
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
Public/Granted literature
- US20100301475A1 Forming Semiconductor Chip Connections Public/Granted day:2010-12-02
Information query
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