Invention Grant
US08236619B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
有权
制造具有柱/基散热器的半导体芯片组件和多种导电迹线的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
- Patent Title (中): 制造具有柱/基散热器的半导体芯片组件和多种导电迹线的方法
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Application No.: US13092913Application Date: 2011-04-23
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Publication No.: US08236619B2Publication Date: 2012-08-07
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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