To solve a problem in that a die processing cost increases when employing a method involving providing a suction hole in the die to fix an island onto a bottom surface, provided is a semiconductor device, which includes: a semiconductor chip, an island having a first surface, on which the semiconductor chip is mounted, and a second surface opposing to the first surface, a hanger pin extended from the island, a branch portion extended from one of the island and the hanger pin, and a resin encapsulating the semiconductor chip, the island, the hanger pin and the brunch portion while exposing the second surface of the island.