Invention Grant
- Patent Title: Mold resin sealing device and molding method
- Patent Title (中): 模具树脂密封装置及成型方法
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Application No.: US12929304Application Date: 2011-01-13
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Publication No.: US08236621B2Publication Date: 2012-08-07
- Inventor: Akira Sugai
- Applicant: Akira Sugai
- Applicant Address: JP Tokyo
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2010-005935 20100114
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/00
Abstract:
A mold resin sealing device for sealing a surface of a semiconductor wafer with a mold resin, includes: a first mold die; and a second mold die disposed opposite to the first mold die, the second mold die having a second surface; wherein the first mold die includes a first part having a first surface facing the second surface of the second mold die and having an opening in a central region of the first surface; and a first step-like movable part capable of moving in the opening in both directions so that the first step-like movable part moves toward and away from the second mold die.
Public/Granted literature
- US20110171786A1 Mold resin sealing device and molding method Public/Granted day:2011-07-14
Information query
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