Invention Grant
- Patent Title: Array substrate and manufacturing method
- Patent Title (中): 阵列基板及制造方法
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Application No.: US12888171Application Date: 2010-09-22
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Publication No.: US08236628B2Publication Date: 2012-08-07
- Inventor: Xiang Liu , Zhenyu Xie , Xu Chen
- Applicant: Xiang Liu , Zhenyu Xie , Xu Chen
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN200910093197 20090925
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84

Abstract:
A method of manufacturing an array substrate comprising: forming a data line and a gate line which are crossed with each other and a gate electrode on a base substrate, and the data line is discontinuously disposed so as to be separated from the gate line or the gate line is discontinuously disposed so as to be separated from the data line; forming an active layer and a gate insulating layer including bridge via holes and a source electrode via hole on the base substrate, and the bridge via holes are located at positions respectively corresponding to adjacent discontinuous sections of the data line or adjacent discontinuous sections of the gate line, and the source electrode via hole is located at a position corresponding to the data line; and forming a pixel electrode, a source electrode, a drain electrode and a bridge line on the base substrate, and the pixel electrode and the drain electrode are formed integrally, and the source electrode is connected to the data line through the source electrode via hole, and the bridge line connects the adjacent discontinuous sections of the data line or the adjacent discontinuous sections of the gate line through the bridge via holes.
Public/Granted literature
- US20110073864A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD Public/Granted day:2011-03-31
Information query
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