Invention Grant
US08236670B2 Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate
失效
在衬底上施加金属，金属氧化物和/或半导体材料的图案的方法
- Patent Title: Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate
- Patent Title (中): 在衬底上施加金属，金属氧化物和/或半导体材料的图案的方法
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Application No.: US12294434Application Date: 2007-03-26
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Publication No.: US08236670B2Publication Date: 2012-08-07
- Inventor: Jurina Wessels , Akio Yasuda , Zoi Karipidou , Akos Schreiber , Marc Riedel , Daniel Schwaab , Dirk Mayer , Andreas Offenhaeusser
- Applicant: Jurina Wessels , Akio Yasuda , Zoi Karipidou , Akos Schreiber , Marc Riedel , Daniel Schwaab , Dirk Mayer , Andreas Offenhaeusser
- Applicant Address: DE Berlin DE Juelich
- Assignee: Sony Deutschland GmbH,Forschungszentrum Juelich GmbH
- Current Assignee: Sony Deutschland GmbH,Forschungszentrum Juelich GmbH
- Current Assignee Address: DE Berlin DE Juelich
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: EP06006899 20060331
- International Application: PCT/EP2007/002665 WO 20070326
- International Announcement: WO2007/112878 WO 20071011
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
A method of applying a pattern of metal, metal oxide, and/or semiconductor material on a substrate, a pattern created by that method, and uses of that pattern.
Public/Granted literature
- US20110180906A1 METHOD OF APPLYING A PATTERN OF METAL, METAL OXIDE AND/OR SEMICONDUCTOR MATERIAL ON A SUBSTRATE Public/Granted day:2011-07-28
Information query
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