Etchant and array substrate having copper lines etched by the etchant

Invention Grant

US08236704B2 Etchant and array substrate having copper lines etched by the etchant 有权

Title translation: 具有由蚀刻剂蚀刻的铜线的蚀刻剂和阵列基板

Patent Title: Etchant and array substrate having copper lines etched by the etchant
Patent Title (中): 具有由蚀刻剂蚀刻的铜线的蚀刻剂和阵列基板
Application No.: US12654494

Application Date: 2009-12-22
Publication No.: US08236704B2

Publication Date: 2012-08-07
Inventor: Gyoo-Chul Jo , Ki-Sung Chae
Applicant: Gyoo-Chul Jo , Ki-Sung Chae
Applicant Address: KR Seoul
Assignee: LG Display Co., Ltd.
Current Assignee: LG Display Co., Ltd.
Current Assignee Address: KR Seoul
Agency: McKenna Long & Aldridge LLP
Priority: KR2000-79355 20001220
Main IPC: H01L21/302
IPC: H01L21/302

Abstract:

An etchant includes hydrogen peroxide (H2O2), and a mixed solution including at least one of an organic acid, an inorganic acid, and a neutral salt.

Abstract(Chinese):

蚀刻剂包括过氧化氢（H 2 O 2）和包含有机酸，无机酸和中性盐中的至少一种的混合溶液。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/302	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割