Invention Grant
US08236906B2 Polyamide-imide resin, process for production of polyamide resin, and curable resin composition
有权
聚酰胺酰亚胺树脂，聚酰胺树脂的制造方法和固化性树脂组合物
- Patent Title: Polyamide-imide resin, process for production of polyamide resin, and curable resin composition
- Patent Title (中): 聚酰胺酰亚胺树脂，聚酰胺树脂的制造方法和固化性树脂组合物
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Application No.: US12293648Application Date: 2007-03-20
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Publication No.: US08236906B2Publication Date: 2012-08-07
- Inventor: Takako Ejiri , Katsuyuki Masuda
- Applicant: Takako Ejiri , Katsuyuki Masuda
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2006-078692 20060322; JPP2006-109694 20060412; JPP2006-318852 20061127; JPP2006-318928 20061127
- International Application: PCT/JP2007/055684 WO 20070320
- International Announcement: WO2007/108472 WO 20070927
- Main IPC: C08F283/04
- IPC: C08F283/04
Abstract:
A process for production of a polyamide resin having a reactive double bond, the process including a step of reacting a carboxylic acid and a diisocyanate to produce a polyamide resin, wherein the carboxylic acid component includes a carboxylic acid with a reactive double bond. Also, a polyamideimide resin obtainable by reacting a diisocyanate with a diimidedicarboxylic acid and a reactive double bond-containing carboxylic acid, which has a reactive double bond.
Public/Granted literature
- US20100234554A1 Polyamide-Imide Resin, Process for Production of Polyamide Resin, and Curable Resin Composition Public/Granted day:2010-09-16
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