Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US12564734Application Date: 2009-09-22
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Publication No.: US08237055B2Publication Date: 2012-08-07
- Inventor: Wang-Jia Chen , Wei Zhou , Yu-Hsu Lin , Feng Zhang
- Applicant: Wang-Jia Chen , Wei Zhou , Yu-Hsu Lin , Feng Zhang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910302951 20090605
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area.
Public/Granted literature
- US20100307795A1 CIRCUIT BOARD Public/Granted day:2010-12-09
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