Invention Grant
- Patent Title: Ultra-thin, electronically conductive slice for button use
- Patent Title (中): 超薄,电子导电片用于按钮使用
-
Application No.: US12802181Application Date: 2010-06-01
-
Publication No.: US08237071B2Publication Date: 2012-08-07
- Inventor: Yi-Zen Yeh
- Applicant: Yi-Zen Yeh
- Agent Charles E. Baxley
- Priority: CN200920057627 20090528
- Main IPC: H01H1/20
- IPC: H01H1/20

Abstract:
An ultra-thin, electrically conductive slice for button use, which includes a non-metallic matrix and a metal mesh. The metal mesh is provided in the non-metallic matrix. A plurality of metal touch points are provided on the metal mesh and exposed out of a surface of the non-metallic matrix so as to enable the surface of the non-metallic matrix to form a dense, electrically conductive mesh. The non-metallic matrix is rubber or silica. The metal mesh is electrically conductive.
Public/Granted literature
- US20100300853A1 Ultra-thin, electronically conductive slice for button use Public/Granted day:2010-12-02
Information query