Invention Grant
US08237092B2 Apparatus and method for heating substrate and coating and developing system
有权
用于加热基材和涂层和显影系统的装置和方法
- Patent Title: Apparatus and method for heating substrate and coating and developing system
- Patent Title (中): 用于加热基材和涂层和显影系统的装置和方法
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Application No.: US12880716Application Date: 2010-09-13
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Publication No.: US08237092B2Publication Date: 2012-08-07
- Inventor: Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
- Applicant: Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2005-121267 20050419
- Main IPC: F27B5/14
- IPC: F27B5/14 ; C23C16/00
Abstract:
A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
Public/Granted literature
- US20100330815A1 APPARATUS AND METHOD FOR HEATING SUBSTRATE AND COATING AND DEVELOPING SYSTEM Public/Granted day:2010-12-30
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