Invention Grant
US08237100B2 Image sensor including two image sensing devices in a pixel and method for manufacturing the same
有权
图像传感器包括像素中的两个图像感测装置及其制造方法
- Patent Title: Image sensor including two image sensing devices in a pixel and method for manufacturing the same
- Patent Title (中): 图像传感器包括像素中的两个图像感测装置及其制造方法
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Application No.: US12574761Application Date: 2009-10-07
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Publication No.: US08237100B2Publication Date: 2012-08-07
- Inventor: Hee Sung Shim
- Applicant: Hee Sung Shim
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2008-0100574 20081014
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L31/062

Abstract:
An image sensor is provided. The image sensor comprises a readout circuitry, a first image sensing device, an interconnection, and a second image sensing device. The readout circuitry is disposed in a first substrate. The first image sensing device is disposed at one side of the readout circuitry of the first substrate. The interconnection is disposed over the first substrate and electrically connected to the readout circuitry. The second image sensing device is disposed over the interconnection.
Public/Granted literature
- US20100090093A1 Image Sensor and Method For Manufacturing the Same Public/Granted day:2010-04-15
Information query
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