Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12538534Application Date: 2009-08-10
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Publication No.: US08237205B2Publication Date: 2012-08-07
- Inventor: Masayuki Kamei , Kyouji Yamashita , Daisaku Ikoma
- Applicant: Masayuki Kamei , Kyouji Yamashita , Daisaku Ikoma
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-232571 20080910
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device includes a gate insulating film formed on a semiconductor region of a first conductivity type; a gate electrode formed on the gate insulating film; an offset spacer formed on a side surface of the gate electrode; an inner sidewall formed on the side surface of the gate electrode with the offset spacer interposed therebetween, and having an L-shaped cross section; and an insulating film formed to cover the gate electrode, the offset spacer, the inner sidewall, and a part of the semiconductor region located laterally outward from the inner sidewall. The offset spacer includes an inner offset spacer formed on the side surface of the gate electrode and an outer offset spacer formed to cover the side surface of the gate electrode and the inner offset spacer. The outer offset spacer is in contact with a top end and outer side surface of the inner offset spacer.
Public/Granted literature
- US20100059801A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-03-11
Information query
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