Invention Grant
US08237208B2 Semiconductor device including hydrogen barrier film for covering metal-insulator-meal capacitor and method of manufacturing the same
有权
包括用于覆盖金属 - 绝缘体 - 金属电容器的氢阻挡膜的半导体器件及其制造方法
- Patent Title: Semiconductor device including hydrogen barrier film for covering metal-insulator-meal capacitor and method of manufacturing the same
- Patent Title (中): 包括用于覆盖金属 - 绝缘体 - 金属电容器的氢阻挡膜的半导体器件及其制造方法
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Application No.: US12289824Application Date: 2008-11-05
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Publication No.: US08237208B2Publication Date: 2012-08-07
- Inventor: Takayuki Iwaki
- Applicant: Takayuki Iwaki
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2007-304856 20071126
- Main IPC: H01L29/92
- IPC: H01L29/92 ; H01L21/02

Abstract:
Provided is a semiconductor device including a MIM capacitor, and having excellent waterproof property and antioxidant property even when being formed between wiring layers. The semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a first wiring layer embedded in the first insulating film, a wiring cap film for covering the first wiring layer, the MIM capacitor formed on the wiring cap film, a hydrogen barrier film for covering the MIM capacitor, a second insulating film formed on the hydrogen barrier film, conductive plugs passing through the second insulating film and the hydrogen barrier film, one of which being connected to an upper electrode of the MIM capacitor and the other of which being connected to a lower electrode of the MIM capacitor, and a second wiring layer connected to the conductive plugs, and the upper and lower electrodes of the MIM capacitor.
Public/Granted literature
- US20090134493A1 Semiconductor device and method of manufacturing the same Public/Granted day:2009-05-28
Information query
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