Invention Grant
- Patent Title: Capacitors integrated with metal gate formation
- Patent Title (中): 电容器与金属栅极结合
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Application No.: US13215988Application Date: 2011-08-23
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Publication No.: US08237209B2Publication Date: 2012-08-07
- Inventor: Chung-Long Chang , David Ding-Chung Lu , Chia-Yi Chen , I-Lu Wu
- Applicant: Chung-Long Chang , David Ding-Chung Lu , Chia-Yi Chen , I-Lu Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/108
- IPC: H01L21/108

Abstract:
A semiconductor structure including a capacitor having increased capacitance and improved electrical performance is provided. The semiconductor structure includes a substrate and a MIM capacitor over the substrate. The MIM capacitor includes a bottom plate, an insulating layer over the bottom plate, and a top plate over the insulating layer. The semiconductor structure further includes a MOS device including a gate dielectric over the substrate and a metal-containing gate electrode free from polysilicon on the gate dielectric, wherein the metal-containing gate electrode is formed of a same material and has a same thickness as the bottom plate.
Public/Granted literature
- US20110309420A1 Capacitors Integrated with Metal Gate Formation Public/Granted day:2011-12-22
Information query
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