Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12557495Application Date: 2009-09-10
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Publication No.: US08237223B2Publication Date: 2012-08-07
- Inventor: Shih-Kuei Ma , Ta-Chuan Kuo
- Applicant: Shih-Kuei Ma , Ta-Chuan Kuo
- Applicant Address: TW Hsinchu
- Assignee: Episil Technologies Inc.
- Current Assignee: Episil Technologies Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
A semiconductor device including a substrate, an epitaxial layer, a first sinker, a transistor, a diode unit, a first buried layer, and a second buried layer is provided. When the semiconductor device is operated at the high voltage, the highly large substrate current due to the external load is avoided through the diode unit disposed in the semiconductor device of an embodiment consistent with the invention. Furthermore, according to the design of the semiconductor device, the issue of the narrow input voltage range is improved, and interference of the semiconductor device with the other semiconductor devices is prevented.
Public/Granted literature
- US20110057262A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-03-10
Information query
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