Invention Grant
- Patent Title: Metal-ceramic multilayer structure
- Patent Title (中): 金属陶瓷多层结构
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Application No.: US12692118Application Date: 2010-01-22
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Publication No.: US08237235B2Publication Date: 2012-08-07
- Inventor: Ting-Hau Wu , Chun-Ren Cheng , Shang-Ying Tsai , Jung-Huei Peng , Jiou-Kang Lee
- Applicant: Ting-Hau Wu , Chun-Ren Cheng , Shang-Ying Tsai , Jung-Huei Peng , Jiou-Kang Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L23/495

Abstract:
A metal-ceramic multilayer structure is provided. The underlying layers of the metal/ceramic multilayer structure have sloped sidewalls such that cracking of the metal-ceramic multilayer structure may be reduced or eliminated. In an embodiment, a layer immediately underlying the metal-ceramic multilayer has sidewalls sloped less than 75 degrees. Subsequent layers underlying the layer immediately underlying the metal/ceramic layer have sidewalls sloped greater than 75 degrees. In this manner, less stress is applied to the overlying metal/ceramic layer, particularly in the corners, thereby reducing the cracking of the metal-ceramic multilayer. The metal/ceramic multilayer structure includes one or more alternating layers of a metal seed layer and a ceramic layer.
Public/Granted literature
- US20100258883A1 Metal-Ceramic Multilayer Structure Public/Granted day:2010-10-14
Information query
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