Invention Grant
- Patent Title: Schottky diode device and method for fabricating the same
- Patent Title (中): 肖特基二极管器件及其制造方法
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Application No.: US12607724Application Date: 2009-10-28
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Publication No.: US08237239B2Publication Date: 2012-08-07
- Inventor: Huang-Lang Pai , Hung-Shern Tsai
- Applicant: Huang-Lang Pai , Hung-Shern Tsai
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/872
- IPC: H01L29/872

Abstract:
A Schottky diode device is provided, including a p-type semiconductor structure. An n drift region is disposed over the p-type semiconductor structure, wherein the n drift region comprises first and second n-type doping regions having different n-type doping concentrations, and the second n-type doping region is formed with a dopant concentration greater than that in the first n-type doping region. A plurality of isolation structures is disposed in the second n-type doping region of the n drift region, defining an anode region and a cathode region. A third n-type doping region is disposed in the second n-type doping region exposed by the cathode region. An anode electrode is disposed over the first n-type doping region in the anode region. A cathode electrode is disposed over the third n-type doping region in the cathode region.
Public/Granted literature
- US20110095391A1 SCHOTTKY DIODE DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-04-28
Information query
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