Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12692341Application Date: 2010-01-22
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Publication No.: US08237241B2Publication Date: 2012-08-07
- Inventor: Seiji Otake
- Applicant: Seiji Otake
- Applicant Address: JP Gunma US AZ Phoenix
- Assignee: SANYO Semiconductor Co., Ltd.,Semiconductor Components Industries, LLC
- Current Assignee: SANYO Semiconductor Co., Ltd.,Semiconductor Components Industries, LLC
- Current Assignee Address: JP Gunma US AZ Phoenix
- Agency: Morrison & Foerster LLP
- Priority: JP2009-016230 20090128
- Main IPC: H01L29/86
- IPC: H01L29/86

Abstract:
A conventional semiconductor device has a problem that an on-current of a parasitic transistor flows through a surface portion of a semiconductor layer and thus a semiconductor element undergoes thermal breakdown. In a semiconductor device according to the present invention, a protection element is formed with use of an isolation region and N type buried layers. A PN junction region in the protection element is formed on a P type buried layer of the isolation region. The PN junction region has a junction breakdown voltage lower than that of a PN junction region of a semiconductor element to be protected. This structure allows an on-current of a parasitic transistor to flow into the protection element, and thereby the semiconductor element is protected. In addition, the on-current of the parasitic transistor flows through a deep portion of the epitaxial layer, and thereby the protection element is prevented from thermal breakdown.
Public/Granted literature
- US20100187653A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-07-29
Information query
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