Invention Grant
US08237247B2 CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors
有权
采用嵌入式连接器的混合定向技术(HOT)的CMOS器件
- Patent Title: CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors
- Patent Title (中): 采用嵌入式连接器的混合定向技术(HOT)的CMOS器件
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Application No.: US12555350Application Date: 2009-09-08
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Publication No.: US08237247B2Publication Date: 2012-08-07
- Inventor: Byeong Y. Kim , Xiaomeng Chen , Yoichi Otani
- Applicant: Byeong Y. Kim , Xiaomeng Chen , Yoichi Otani
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Ian D. MacKinnon, Esq.
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
The present invention relates to complementary devices, such as n-FETs and p-FETs, which have hybrid channel orientations and are connected by conductive connectors that are embedded in a semiconductor substrate. Specifically, the semiconductor substrate has at least first and second device regions of different surface crystal orientations (i.e., hybrid orientations). An n-FET is formed at one of the first and second device regions, and a p-FET is formed at the other of the first and second device regions. The n-FET and the p-FET are electrically connected by a conductive connector that is located between the first and second device regions and embedded in the semiconductor substrate. Preferably, a dielectric spacer is first provided between the first and second device regions and recessed to form a gap therebetween. The conductive connector is then formed in the gap above the recessed dielectric spacer.
Public/Granted literature
- US20090321794A1 CMOS DEVICES INCORPORATING HYBRID ORIENTATION TECHNOLOGY (HOT) WITH EMBEDDED CONNECTORS Public/Granted day:2009-12-31
Information query
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