Invention Grant
- Patent Title: Method and apparatus for cooling an integrated circuit
- Patent Title (中): 用于冷却集成电路的方法和装置
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Application No.: US12651002Application Date: 2009-12-31
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Publication No.: US08237263B2Publication Date: 2012-08-07
- Inventor: Ting-Hau Wu , Chun-Ren Cheng , Chun-Wen Cheng , Jiou-Kang Lee , Jung-Huei Peng , Shang-Ying Tsai , Te-Hsi Lee
- Applicant: Ting-Hau Wu , Chun-Ren Cheng , Chun-Wen Cheng , Jiou-Kang Lee , Jung-Huei Peng , Shang-Ying Tsai , Te-Hsi Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34

Abstract:
An integrated circuit, a method of operating the integrated circuit, and a method of fabricating the integrated circuit are disclosed. According to one of the broader forms of the invention, a method and apparatus involve an integrated circuit that includes a heat transfer structure having a chamber that has a fluid disposed therein and that extends between a heat generating portion and a heat absorbing portion. Heat is absorbed into the fluid from the heat generating portion, and the fluid changes from a first phase to a second phase different from the first phase when the heat is absorbed. Heat is released from the fluid to the heat absorbing portion, and the fluid changes from the second phase to the first phase when the heat is released.
Public/Granted literature
- US20110156245A1 Method and Apparatus for Cooling an Integrated Circuit Public/Granted day:2011-06-30
Information query
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