Invention Grant
- Patent Title: Integrated circuit package with redundant micro-bumps
- Patent Title (中): 集成电路封装，带有冗余微型突起
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Application No.: US12779806Application Date: 2010-05-13
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Publication No.: US08237274B1Publication Date: 2012-08-07
- Inventor: Arifur Rahman
- Applicant: Arifur Rahman
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent LeRoy D. Maunu; Thomas George
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44
Abstract:
A semiconductor device is provided that includes a substrate having opposing first and second surfaces and an interconnect structure extending between the first and second surfaces. A plurality of bond pads are located on the first surface of the substrate and the bond pads are electrically connected to the interconnect structure. The bond pads each have two or more micro-bumps, with the two or more micro-bumps on each bond pad being arranged to electrically connect the bond pad to one die pad of a semiconductor die. A plurality of external contacts are located on the second surface of the substrate and the external contacts are electrically connected to the interconnect structure.
Information query
IPC分类:
