Invention Grant
- Patent Title: Dicing tape-integrated wafer back surface protective film
- Patent Title (中): 切割胶带集成晶圆背面保护膜
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Application No.: US12696135Application Date: 2010-01-29
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Publication No.: US08237294B2Publication Date: 2012-08-07
- Inventor: Naohide Takamoto , Takeshi Matsumura
- Applicant: Naohide Takamoto , Takeshi Matsumura
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-020460 20090130; JP2009-251125 20091030
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
Public/Granted literature
- US20100193968A1 DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM Public/Granted day:2010-08-05
Information query
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