Invention Grant
- Patent Title: Wideband high impedance bridging module
- Patent Title (中): 宽带高阻抗桥接模块
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Application No.: US12485383Application Date: 2009-06-16
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Publication No.: US08237427B2Publication Date: 2012-08-07
- Inventor: Thomas W. Durston
- Applicant: Thomas W. Durston
- Applicant Address: US RI Providence
- Assignee: Textron Innovations Inc.
- Current Assignee: Textron Innovations Inc.
- Current Assignee Address: US RI Providence
- Agency: Clark Hill PLC
- Main IPC: G01R19/00
- IPC: G01R19/00 ; G01R27/00

Abstract:
A bridge module provides connection between first and second conductors of a line under test and a test instrument adapted for use with the bridge module. The bridge module provides monitoring and measurement of DSL communication signals between the telephone company DSL terminal (DSLAM) and the subscriber home DSL equipment across a wide range of frequencies. The bridge module can be used at any point in the communications link and can be used while the link is active. The bridge module provides a clickless connection to the active DSL communications link to avoid interruption in DSL service.
Public/Granted literature
- US20100315065A1 WIDEBAND HIGH IMPENDANCE BRIDGING MODULE Public/Granted day:2010-12-16
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